From: Sonny Hung (sonnyhung_at_hotmail.com)
Date: Thu May 27 2004 - 07:45:47 PDT
Humphreys, David wrote:
Thu, 27 May 2004 07:15:27 -0700
>The adhesive that holds the copper on the board will soften with applied
>heat. The advantage of >using 63/37 is both obvious and not so obvious. The
>lower temperature is the obvious point. There >will be less chance of
>delaminating. The not so obvious point is that the eutectic nature of the
>alloy >means that once it starts to melt you know the temperature to within
>a degree or so and you >don't need as hot an iron.
>Set the temp to 350F and that will be optimum.
>
>Also, because of the eutectic nature of the alloy, the solidus phase is
>well defined. This means that >there is no pasty phase and the joint will
>'set-up' almost immediately upon heat removal - definitely >an advantage to
>avoiding 'cold-solder' joints. Now you can use Tin/Silver solder but it is
>not the >best for electronic board work. It is better as a hobbyist solder
>for model railroad tracks due to the >superior strength of the joints it
>makes.
Thanks David, this really gave me a quick tutor on the subject of solder and
soldering. I take this to the bench when I do my Acceleration mods.
God bless,
Sonny Hung
the Hung Family
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